Soder-Wick® offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.
All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen.
Soder-Wick® Rosin 5' and 10' spools packaged in ESD-safe static dissipative bobbinsMinimizes the risk of damage associated with static electricityNoncorrosive ultra high purity Type R rosin fluxMinimizes the risk of heat damage to the boardWill not leave ionic contamination on the boards
Soder-Wick® Rosin 5' and 10' spools packaged in ESD-safe static dissipative bobbinsBGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
MIL-F-14256 F type R fluxNASA-STD-8739.3 Soldered Electrical ConnectionsDOD-STD-883E, Method 2022ANSI/IPC J STD-004, Type ROL0
