Descripción

Para limpieza de residuos de flux en PCB´s – Se aplica puro.

Características

VIGON® SC 202, based on MPC® Technology (Micro Phase Cleaning), is an aqueous-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. The product has also been developed to clean double-sided misprints, with one side already soldered. The cleaning agent is recommended to be used in spray-in-air and ultrasonic cleaning systems.

Specifically developed for the removal of fluxes from doublesided misprinted boards with one side soldered

Easily filtered and therefore provides an extended bath life and reduces cleaning agent costs

Surfactant-free and can be easily rinsed residue-free

No flash point and can be used in equipment without explosion proof protection

The cleaner is applicable in spray-in-air systems and ultrasonic dip tanks

No foaming when used in spray-in-air systems

Halogen free

Low odor